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HOME > Product > Semiconductor > Etching wafer

Description

Process

Ability and accuracy

Photoresist coating

Spin coating

Glue thickness accuracy≤3%

(Applicable to plane)

Photoresist coating

Spin coating

Glue thickness accuracy ≤10%

(Suitable for flat/concave surface)

Photolithography

Accuracy 2um

Registration accuracy: 0.15um

Development

Accuracy 2um

Development uniformity <5%

Etching

Size dispersion ±1um

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